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Process optimization through solder paste inspection (3D-SPI)

  • SPI system used in SMT production
  • control of the solder paste pressure in the circuit board production
  • state-of-the-art SPI technology at GBS
  • testing of all essential 3D features of the applied solder paste
  • reliable error detection
  • ensuring an optimal process - right from the start

Electronics manufacturing is characterized by an ever increasing miniaturization of components. At the same time, the demands on throughput and efficient assembly of the printed circuit boards are increasing.

3D paste images identify possible errors and opportunities for improvement

Despite these emerging challenges, Grundig Business Systems ensures that the "Made in Germany" quality standard is maintained!

The continuous control of every single production step is of great importance. An initial check is carried out as soon as the solder paste has been applied to the beginning of the SMD line. The powerful SPI sensor technology enables the solder paste application to be checked with the highest precision and speed. Using customer-specific software adjustments, individual pads can be checked longer and more extensively by the SPI. A random visual inspection of individual printed circuit boards is therefore no longer necessary, which significantly increases both the process speed and the process reliability of the EMS. This reflects the Grundig Business Systems Standard and also meets the requirements of our automotive customers. Even the smallest components, such as those fitted with 01005 components, are no obstacle to the system.