Reflow soldering
- process for soldering SMD components
- apply solder paste to the board before assembly
- reflow soldering system from SMT Maschinen-und Vertriebs GmbH & Co. KG
- suitable for extremely complex assemblies in large series production
Reflow soldering step by step
First, the board is provided with solder paste, then the modules can be assembled. Solderable connection points on the undersides of the electronic components guarantee an immediate connection to the circuit board provided with solder paste. The great advantage of the solder paste used is that it has a sticky consistency. This means that the components adhere directly to the paste and do not have to be fixed separately. Then the soldering process itself begins by heating the electronic components in the reflow oven.
Reflow soldering with convection
A common method is convection soldering under nitrogen or air. To heat the components, the nitrogen or air is heated and brought onto the printed circuit board by a nozzle system. Nitrogen offers optimal protection against oxidation and improves heat transfer.
The circuit boards usually go through several heating and cooling zones. The first heating zones are used to preheat the circuit board and activate the flux. In the peak zones, the circuit board reaches the melting temperature of the solder. In the subsequent cooling zones, the solder is cooled in a defined manner and the solder joint is formed. Due to the efficient heat transfer and the optimal nitrogen regulation, overheating of the sensitive components can be avoided. Convection soldering under nitrogen is one of the most common methods in reflow soldering.